ict26 logo

The Abstract Submission Site is Now Open.

Deadline: January 31, 2026

The organizers are pleased to open the site for submission of abstracts. CERN’s Indico System has been selected for our Program Committee’s abstract management functions. Please read the general guidelines for submission, instructions for preparing your abstract, and procedures for submitting your work for consideration.

Guidelines for Submission (PDF)

Call for Abstracts

ICT2026 Conference Topics

  • A.Theory & Computation
    • A1 : Theoretical study of bulk materials
    • A2 : Nanoscale & low-dimension induced effects
    • A3 : Novel concepts & related physical phenomenon
    • A4 : Informatics, data mining, & machine learning
    • A5 : Modeling of heat transfer
    • A6 : Other theoretical considerations
  • B. Thermoelectric Materials
    • B1 : Antimonides
    • B2 : Chalcogenides
    • B3 : Heusler compounds
    • B4 : Oxides & silicides
    • B5 : Organic & hybrid materials
    • B6 : Magnetism-related materials
    • B7 : Materials processing
    • B8 : Other material-related topics
  • C. Measurements & Characterization
    • A1 : Theoretical study of bulk materials
    • A2 : Nanoscale & low-dimension induced effects
    • A3 : Novel concepts & related physical phenomenon
    • A4 : Informatics, data mining, & machine learning
    • A5 : Modeling of heat transfer
    • A6 : Other theoretical considerations
  • D. Thermoelectric Modules
    • D1 : Design & fabrication
    • D2 : Thin film devices
    • D3 : Bulk devices
    • D4 : Standardization
    • D5 : Other TE module considerations
  • E. Systems & Industrial Applications
    • E1 : Cooling applications
    • E2 : Automotive applications
    • E3 : Generator applications
    • E4 : Sensor applications
    • E5 : Other waste heat recovery
    • E6 : Other industrial aspects
  • F. Materials for Thermal Management
    • F1 : High and low thermal conductivity materials
    • F2 : Radiative cooling, both active and passive
    • F3 : Interfacial phenomena
    • F4 : Other materials & mechanisms for thermal management